Special Instrument

Agilent GC/LC

	GC
	LC
	LCD

Spectrophotometer

	Spectrophotometer
	1.User-configured
	2.General-purpose
	3.Fluorescence
	4.Application-ready
	5.Raman Systems
	Ligth Source
	NIR
	RAMAN
	LIBS
	Sample setup
	OLED Setup
	Applications & Color
	Understand Basic

Flow Injection Analysis (FIA)

	FIA System

Spin Coater

	Spin Coater

Bio Sensor

	Bio Sensor - SPR

Contact Angle

	Gontact Angle
	Product Range
	Drop Image software
	Theory Base

Plasma Cleaner

	Plasma Cleaner

Mask Aligner

	Mask Aligner

General lab Instruments

General Lab

Auto desiccator
Autoclave Sturdy

Autoclave Nuve

Blender

Burner
Bath-Water Bath-Memert
Centrifuge-Micro LMS 
Hotplate Stirres LMS

Freeze Drying
Incubator memmert

Peristaltic Pumps

Syringe Pump
Pipett/Dispens. Nichiryole
Rotary evaporator
Ultrasonic Cleaner
Vortex LMS

Nuve

	All catalog
	Autocalve OT 4060
	Autoclave OT 012
	Autoclave OT 020
	Autoclave OT 032
	Blood Refrigerate KN120
	Centrifuge HN 075
	Centrifuge HF 800
	Centrifuge Small Bench
	Cool incubator ES 110
	Dry overn FN 032
	Furnance MF 120
	Incubator EN 025
	Incubator EN 400
	Laminar Dlow LN
	Safety cabinet MN
	Stirer MK
	Vacuum Oven
	Water Bath BM
	Water Bath NB
	Water Still NS 103
	Water Still NS 104

Water Quality Instru.

	pH Meter
	ORP/REDOX
	Conductivity
	TDS
	Colorimeter
	Turbidity
	Thermometer
	Multi parameter

Made to Order

NDN's Products

	Glove Box
	Electro Luminescense
	Gem LIBS

Used Instruments

From USA

	Used catalog

NDN Acknowledge

Instruments

	Choose Centrifuge
	Extract Rotary evap
	OLED Setup
	Contact Angle Work

Mask Aligner

MJB4

Features and Benefits

High resolution manual mask aligner capable to print features of 0.5 µm
Wafer and substrate handling up to 4" (wafers), 4"x4" (substrates)
Special substrate chucks for pieces, III-V materials, thick substrates, hybrids and HF components
High precision X, Y, Q alignment stage and microscope manipulator
High intensity optical setups for different UV- exposure wavelengths up to 90mW/cm²

The SUSS MJB4 is the next generation version of the highly popular manual mask aligner the SUSS MJB3. It is the ideal, economical unit for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 µm, a performance unsurpassed in any other comparable machine.

The machine is widely used for MEMS and optoelectronics applications. It is specially configured for handling non-standard substrates such as hybrids, high-frequency components or fragile III-V materials, such as GaAs or InP. The tool can be equipped with either a SUSS Singlefield or a Splitfield Microscope enabling fast and highly accurate alignment.

MA/BA6

Features and Benefits

Accurate and precise gap setting for higher yield
Parameter storage saves set-up time and improves process consistency
High-quality exposure optics: Diffraction reducing lenses provide high resolution and optimum edge quality with thick resists
High intensity light sources reduce process time
Intelligent exposure control unit monitors lamp intensity and life time

The SUSS MA6 Mask Aligner is regarded as the benchmark from semiconductor submicron research to 3D micro-system production. The innovative systems meets customer's needs for precision, reliability and low cost of ownership.

The versatile MA6 is available with bottom-side-alignment microscopes for accurate backside processes. Bottom-side-alignment has become an important feature, especially in Microsystem Technology.

For all classic lithography and topside alignment an eyepiece or a dual video microscope are available. Beside the standard lithography application with diffraction reducing exposure optics for highest resolution the MA6 Mask Aligner offers special techniques for :

Bond Alignment,
Near Field Holography,
UV-Curing processes,
UV-NIL, etc.

MA/BA8

Features and Benefits

Multiple exposure modes and precise gap setting for optimized lithography processes
Dual video or eye piece microscope
BSA microscope with dual magnification
SUSS image storage for precision alignment even in large gaps
Optimum exposure quality also in thick resists:
steep edge slopes and high aspect ratio

The SUSS MA8 Maks Aligner is the system solution for 200mm lithography applications for development and pilot production of IC back end processes. The MA8 provides full laboratory mask aligner versatility and flexibility. The compatibility of the exposure modes allows processes to be developed on the MA8 which can then be run in production on a SUSS MA200 Production Mask Aligner.

The MA8 meets the requirements of back end applications such as passivation and thin film bumping. Thick resist performance also recommends the MA8 for microsystem technology applications where bottom side alignment is requested. The MA8 is also regarded as an ideal tool for telecom and optoelectronics applications.

Beside the standard lithography application with diffraction reducing exposure optics for highest resolution the MA8 offers special techniques for:

Bond Alignment,
Near Field Holography,
UV-Curing processes,
UV-NIL, etc.

104/87 Moo10 Soi Petchkasem 63/4 , Bangkae, Bangkae, Bangkok 10160
Tel (662) 444-4655 (5 Auto), Fax (662) 4444-650 THAILAND email : nok@ndn.co.th